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resolution 2540 dpiDRS Debris Removal SystemGlunz & Jensen plate developer C85Light source 1x laser head Gen 1 - 64 diodesMin. plate size 240 x 240 mmPlate thickness 0.15 - 0.30 mmPlate type thermal aluminum plates 830 mmProductivity: up to 17 plates / hRIPMax.plate size ...
Plate format: Maximum 830 x 660 mm, Minimum 324 x 370 mmPower supply: 200-240V, 50/60 HzComputercontrol SystemMPS68Exposure technology: Thermal CTP systemweight ca. 1.000 kgSpeed: Up to 21 plates per hour (at 2,400 dpi)ONE TH 85 plate developerPlate thickness: 0.15 mm to 0.30...
16 diodes
16 diodes
